BH-22008 Single-Component Low-Temperature Curing Epoxy Material Product Descript
BH-22008 Single-Component Low-Temperature Curing Epoxy Material
Product Description In the consumer electronics materials industry, the trend towards smaller, lighter, thinner, and faster products is prevalent. Achieving compact and lightweight designs while maintaining powerful processing capabilities poses a significant challenge. Manufacturers are increasingly using non-traditional materials like metals, glass, and plastics in product structures, necessitating lower application temperatures and improved bonding efficiency during assembly. Slow-curing materials or those with short working lifespans are no longer viable solutions for mass production.
High-performance, low-temperature curing reactive epoxy adhesives provide an ideal solution to these challenges. These adhesives are suitable for various substrates, including FPC/PCB and different specifications of liquid crystal polymers (LCP), meeting both current and future bonding requirements in the consumer electronics sector. They offer comprehensive support to resolve bonding issues encountered in practical applications.
Product Features
- Versatile Bonding: Suitable for a wide range of substrates.
- Fast Curing: Low-temperature and fast-curing capabilities.
- Strong Adhesion: Excellent bonding performance with low surface energy materials.
- Durable: High thermal resistance and impact performance.
- User-Friendly: Long pot life and easy handling.
Product Specifications
| Product | Features | Color | Viscosity (cps @ 25°C) | TI | Tg (°C) | Curing Conditions | Pot Life (days @ 25°C) |
|---|---|---|---|---|---|---|---|
| BH-22008-1 | General-purpose, good adhesion to various substrates | Black | 21000 | 6 | 55 | 30 min @ 80°C | 3 |
| BH-22008-2 | Low viscosity version PTE2 | Black | 8000 | 4.3 | 51 | 30 min @ 80°C | 3 |
| BH-22008-3 | Low-temperature fast curing | Black | 20000 | 6 | 54 | 30 min @ 60°C | 2 |
| BH-22008-4 | Low outgassing, fast curing | Black | 24000 | 5.5 | 46 | 30 min @ 80°C | 3 |
| BH-22008-5 | Excellent bonding to low surface energy materials like LCP and PA | Black | 19500 | 4.9 | 45 | 30 min @ 80°C | 3 |
| BH-22008-6 | Excellent bonding to PC materials | Black | 25000 | 4.9 | 44 | 30 min @ 80°C | 3 |
| BH-22008-7 | High heat resistance, high Tg | Black | 19000 | 5 | 94 | 60 min @ 85°C | 3 |
| BH-22008-8 | Excellent impact resistance, low hardness | Black | 25000 | 3.1 | 30 | 30 min @ 80°C | 3 |
| BH-22008-9 | Excellent bonding to metal materials | Black | 1150 | 4.7 | 43 | 30 min @ 85°C | 3 |
Market Analysis
BH-22008 targets the consumer electronics industry, which demands high-performance materials for compact, lightweight, and efficient devices. The increasing complexity and miniaturization of electronics drive the need for advanced adhesives that can perform well under low-temperature curing conditions.
Global Market Trends
- Miniaturization and Lightweight Designs: The trend towards smaller and lighter consumer electronics requires adhesives with superior bonding capabilities at lower temperatures.
- High-Performance Materials: The need for materials that can bond diverse substrates like metals, glass, and plastics efficiently is increasing.
- Technological Advancements: Innovations in adhesive technologies, focusing on faster curing times and improved performance, are gaining traction.
- Environmental and Safety Standards: The shift towards halogen-free and low smoke materials aligns with global environmental and safety regulations.
Regional Market Analysis
- North America: Driven by the high demand for advanced consumer electronics and the presence of major electronics manufacturers.
- Europe: A significant market due to the high consumption of advanced electronics and stringent safety and environmental standards.
- Asia-Pacific: Rapid economic growth, urbanization, and the dominance of electronics manufacturing hubs like China, South Korea, and Japan drive the market.
- Middle East and Africa: Growing consumer electronics market with increasing investments in manufacturing infrastructure.
- Latin America: Emerging market with increasing demand for advanced electronics and investments in manufacturing capabilities.
Market Entry Strategy
- Regulatory Compliance: Ensure the product meets regional safety and environmental standards. Obtain necessary certifications to enhance product acceptance.
- Strategic Partnerships: Form alliances with local distributors, electronics manufacturers, and assemblers to establish a strong market presence. Build credibility through partnerships.
- Marketing and Awareness Campaigns: Conduct targeted marketing campaigns highlighting the benefits of BH-22008, such as low-temperature curing, fast curing times, and strong adhesion. Emphasize compliance with stringent safety standards.
- Customization and Innovation: Tailor products to meet regional needs and preferences. Innovate to improve performance and address specific market demands.
- Distribution Network: Develop a robust distribution network to ensure product availability and timely delivery. Leverage local expertise for supply chain efficiency and customer service.
- Training and Support: Provide training programs for users on the benefits and applications of BH-22008. Offer technical support to enhance customer satisfaction and loyalty.
- Sustainability Focus: Highlight the eco-friendly aspects of BH-22008 in all marketing efforts. Position the product as a solution for environmentally conscious projects.
- Competitive Pricing: Implement competitive pricing strategies to attract cost-sensitive customers. Emphasize long-term cost savings associated with the product’s performance and durability.
By aligning the market entry strategy with global and regional trends, BH-22008 Single-Component Low-Temperature Curing Epoxy Material can effectively penetrate and capture significant market share in the consumer electronics materials industry.
