BH-22009 Single-Component Medium to High-Temperature Curing Epoxy Material
BH-22009 Single-Component Medium to High-Temperature Curing Epoxy Material
Product Description High-performance medium to high-temperature curing adhesives can meet the current and future bonding requirements in the industrial, automotive, and consumer electronics sectors. They are widely used in the manufacturing of aircraft, automobiles, bicycles, ships, golf clubs, skis, FR4 board-level packaging, potting, and other applications. These adhesives are highly versatile, catering to various applications requiring high-strength bonding and environmental resistance. Through different formulations, these epoxies can be adjusted to offer more plasticity or rigidity, transparency, or opacity, meeting nearly any requirement for bonding metals, glass, stone, carbon fiber, FR4, and other materials. They effectively solve bonding issues encountered in practical applications.
Key Features
- Single-component product with long shelf life at -20°C or lower
- High adhesion to various substrates (glass, metal, FR4, carbon fiber)
- High reliability and heat resistance (some products withstand temperatures above 220°C)
- Low stress, high ductility, impact resistance, and high fatigue resistance for harsh conditions
- High peel and shear strength for critical applications, ensuring strong bonding properties
- Available in liquid, paste, or film form for easy application
- Controllable rheology
Product Specifications
| Product | Features | Color | Viscosity (cps @ 25°C) | Tg (°C) | Curing Conditions | Storage Temperature (°C) |
|---|---|---|---|---|---|---|
| BH-22009-1 | Fast flow at room temperature, easy to repair, BGA, CSP underfill | Black | 350-450 | 102 | 8 min @ 130°C | -40 |
| BH-22009-2 | Excellent SIR performance, BGA, CSP underfill | Black | 400-500 | 109 | 8 min @ 150°C | -40 |
| BH-22009-3 | High reliability, non-repairable, WLCSP underfill | Black | 4500-5500 | 130 | 8 min @ 150°C | -40 |
| BH-22009-4 | Flexible, low Tg, low modulus, suitable for PCB local protection | Black | 9000-11000 | 5 | 8 min @ 130°C | -40 |
| BH-22009-5 | High Tg, high reliability, thermal potting for automotive and outdoor equipment | Black | 50000 | 140 | 2 h @ 140°C | -40 |
| BH-22009-6 | Medium temperature fast curing, potting for transistors and semiconductor devices | Black | 54000 | 138 | 15 min @ 150°C | -40 |
| BH-22009-7 | Excellent SIR performance, low outgassing, micro-gap bonding and sealing | Black | 23000 | 96 | 20 min @ 150°C | -40 |
| BH-22009-8 | High Tg, high bonding strength for metals, glass, FR4 | Black | 7000 | 122 | 30 min @ 150°C | -40 |
| BH-22009-9 | Conductive, thermally conductive, low shrinkage, Au material, chip bonding | Silver | 8000 | -46 | 30 min @ 175°C | -40 |
| BH-22009-10 | Fast flow at room temperature, easy to repair, BGA, CSP underfill | Black | 350-450 | 102 | 8 min @ 130°C | -40 |
| BH-22009-11 | Excellent SIR performance, BGA, CSP underfill | Black | 400-500 | 109 | 8 min @ 150°C | -40 |
| BH-22009-12 | High reliability, non-repairable, WLCSP underfill | Black | 4500-5500 | 130 | 8 min @ 150°C | -40 |
| BH-22009-13 | Flexible, low Tg, low modulus, suitable for PCB local protection | Black | 9000-11000 | 5 | 8 min @ 130°C | -40 |
| BH-22009-14 | High Tg, high reliability, thermal potting for automotive and outdoor equipment | Black | 50000 | 140 | 2 h @ 140°C | -40 |
| BH-22009-15 | Medium temperature fast curing, potting for transistors and semiconductor devices | Black | 54000 | 138 | 15 min @ 150°C | -40 |
| BH-22009-16 | Excellent SIR performance, low outgassing, micro-gap bonding and sealing | Black | 23000 | 96 | 20 min @ 150°C | -40 |
| BH-22009-17 | High Tg, high bonding strength for metals, glass, FR4 | Black | 7000 | 122 | 30 min @ 150°C | -40 |
| BH-22009-18 | Conductive, thermally conductive, low shrinkage, Au material, chip bonding | Silver | 8000 | -46 | 30 min @ 175°C | -40 |
Regional Market Analysis
- North America: Driven by the high demand for advanced industrial and automotive adhesives and the presence of major manufacturers.
- Europe: A significant market due to the high consumption of advanced adhesives in various industries and stringent safety and environmental standards.
- Asia-Pacific: Rapid economic growth, urbanization, and the dominance of manufacturing hubs like China, South Korea, and Japan drive the market.
- Middle East and Africa: Growing industrial sector and increasing investments in manufacturing infrastructure.
- Latin America: Emerging market with increasing demand for high-performance adhesives in industrial and automotive applications.
