DC-98001 4.0W/m·K Anti-Settling Potting Thermal Conductive Powder
Product Features:
The powder is produced from core materials and oxides through a special process, offering ultra-high thermal conductivity, insulation, and neutrality. Our company, in response to industry needs, has developed a specialized thermal conductive powder for the production of electronic potting compounds, following extensive testing. This product simplifies customer selection, enhances product quality, reduces production costs, and shortens delivery times.
Product Characteristics:
- High Purity: The product is of high purity, ensuring stability and consistency during use.
- Narrow Particle Size Distribution: The product has a narrow particle size distribution, aiding in the formation of a continuous thermal conduction network within the potting compound.
- Low Oil Absorption Value: The low oil absorption value minimizes the impact of the filler on the performance of the potting compound, ensuring stability.
- High Fill Rate: The product allows for a high fill rate, forming more thermal conduction paths within the potting compound, thereby improving thermal conductivity.
- Excellent Thermal Conductivity: The product itself has excellent thermal conductivity, significantly enhancing the thermal conductivity of the potting compound.
- Anti-Settling Performance: The product exhibits excellent anti-settling performance, maintaining a good dispersion state even after prolonged storage and use.
Usage Instructions:
When using DCS-4009, it needs to be mixed with 50cps silicone oil at a ratio of 1:13. Ensure thorough mixing to evenly disperse the filler in the silicone oil. After sufficient mixing, a thermal conductive adhesive with a thermal conductivity of 4.0W/m·K can be prepared.
Application Fields:
DCS-4009 thermal conductive filler is suitable for use in silicone potting compounds, primarily used for potting and sealing electronic components that require good thermal conductivity.
Storage and Packaging:
- Packaging Specifications: The standard packaging for DCS-4009 thermal conductive filler is 25kg per bag, which is convenient for transportation and storage.
- Shelf Life: The product has a shelf life of 3 months when stored in a cool, dry, and sealed environment. It is recommended to use the product within the shelf life to ensure optimal performance.
Specifications
1. Basic Composition:
Name Chemical Name Content (%) CAS Number Aluminum Oxide Al₂O₃ >99.9 1344-28-1 Silicon Dioxide SiO₂ <0.040 60676-86-0 Ferric Oxide Fe₂O₃ <0.040 1309-37-1 2. Physical Data:
Test Item Unit Standard Test Result Appearance - White Powder Visual D50 µm <15 8.04 Oil Absorption ml/100g <20 14.12 Whiteness % >85 87.21 pH Value - 7-9 8.2 Moisture % <0.4 0.39 Application Scenarios&Downstream Customer Analysis
Application Scenarios:
-
Electronic Encapsulation and Potting: DC-98001 4.0W/m·K Anti-Settling Potting Thermal Conductive Powder is ideal for use in electronic encapsulation and potting materials. It helps in maintaining a uniform thermal conductivity across electronic components such as power modules, transformers, and other sensitive electronics that require effective heat dissipation to enhance reliability and performance.
-
Automotive Electronics: This product is particularly suitable for automotive electronic components like ECU (Engine Control Units) and power inverters, where efficient heat dissipation is critical. The anti-settling feature ensures that the thermal conductive properties are consistent throughout the lifespan of the product.
-
Industrial Equipment: The product is also applicable in industrial equipment where high thermal conductivity is needed for heat dissipation, such as in control panels, sensors, and heavy machinery that operate under high thermal loads.
-
Renewable Energy Systems: In renewable energy applications, particularly in solar inverters and wind turbine control systems, this thermal conductive powder can be used to improve heat management, ensuring system efficiency and longevity.
Downstream Customer Groups:
-
Electronics Manufacturers: Companies producing power electronics, transformers, and other devices that require effective thermal management during encapsulation and potting processes.
-
Automotive Manufacturers: Automotive OEMs and suppliers that focus on the production of critical electronic components such as engine control units, inverters, and battery management systems.
-
Industrial Equipment Manufacturers: Companies that manufacture industrial control equipment, heavy machinery, and sensors that require reliable thermal dissipation solutions.
-
Renewable Energy Companies: Manufacturers and integrators of solar inverters, wind turbine electronics, and other renewable energy systems that need efficient thermal management to maintain performance and durability.
Market Opportunities and Potential Analysis
Latin American Market:
The Latin American market is seeing significant growth in the automotive and electronics manufacturing sectors. As these industries modernize, the demand for advanced thermal management solutions is increasing. DC-98001’s high thermal conductivity and anti-settling properties make it a valuable product in this region. Moreover, the ongoing expansion in renewable energy projects in Latin America offers additional opportunities for this product in solar and wind energy systems.
Arab Countries:
Arab countries are rapidly advancing in terms of infrastructure and industrial development, particularly in electronics and automotive sectors. The harsh climate conditions, with high temperatures, make thermal management a critical concern. This product’s ability to maintain consistent thermal conductivity over time, even in extreme conditions, makes it well-suited for use in this region, providing ample opportunities in the growing industrial and automotive markets.
African Market:
Africa’s industrialization and growing automotive and electronics sectors present a significant opportunity for DC-98001. The product’s durability and reliability in varying environmental conditions, coupled with the increasing demand for advanced thermal management solutions in electronics and renewable energy sectors, make it a promising option for the African market. As more countries in Africa invest in infrastructure and manufacturing, the need for effective heat dissipation materials will continue to rise.
Recommended Resources and Conditions for Distributors
Recommended Resources or Conditions:
-
Technical Expertise: Distributors should have a basic understanding of thermal management and electronic potting processes to effectively market and support the product.
-
Industry Connections: Access to key players in the electronics, automotive, and industrial equipment manufacturing sectors will be crucial for entering the market and establishing a customer base.
-
Marketing Capabilities: Distributors should have a well-established marketing network that can reach electronics manufacturers, automotive companies, and industrial equipment producers to promote the product’s benefits.
-
Local Market Knowledge: A strong understanding of local industrial needs and regulatory requirements will help in effectively positioning the product in the target markets.
Key Customer Targets
Key Customer Targets for Market Development:
-
Electronics Manufacturers: Companies involved in producing high-end electronic components and devices that require consistent and reliable thermal management solutions.
-
Automotive Industry Players: OEMs and suppliers that focus on critical electronic components in vehicles, including engine control units and inverters.
-
Industrial Equipment Manufacturers: Manufacturers that require reliable thermal dissipation solutions for machinery and control equipment used in high-temperature environments.
-
Renewable Energy Companies: Firms involved in the production and maintenance of solar and wind energy systems, where efficient heat management is crucial for operational efficiency.
-
