GJ-58002 Buried Layer Epitaxial Wafer Manufacturing
Product Information:
Buried layer silicon epitaxy involves growing a crystalline silicon film on a polished wafer with pre-patterned circuits (buried layer), ensuring the resulting layer meets electrical, resistivity, thickness, and lattice structure requirements. This process demands precise control over electrical parameters and defect management compared to standard epitaxy.
Product Specifications:
- Diameter: 200 mm
- Doping: P-type (Boron), N-type (Phosphorus)
- Epitaxial Layer Thickness: 1-50 µm
- Resistivity: 0.03-1000 ohm-cm
- Layers: Single or multiple
Process Introduction: Buried layer epitaxy requires protecting the pre-patterned circuits from distortion and drift. Shanghai Hejing customizes this technology, ensuring uniform temperature fields in epitaxial furnaces, solving drift and self-doping issues, and producing high-quality buried layer epitaxial wafers comparable to those of top international semiconductor manufacturers.
Process Steps:
- Epitaxial Growth: Chemical vapor deposition forms a single or multilayer crystalline structure on the polished wafer, with precise control over critical parameters.
- Wafer Cleaning: Removes contaminants like dust, organic matter, and metals.
- Wafer Inspection: Measures physical properties like resistivity, thickness, flatness, and more, followed by a final cleaning.
- Packaging: Wafers are stored in boxes, sealed with PE and aluminum foil bags, protecting them during storage and transport.
Applications: Buried layer epitaxy is widely used in power management ICs and other specialized platforms due to its ability to reduce series resistance, simplify isolation, and enhance device performance.
Application Scenarios:
Application Scenarios and Target Customers:
The GJ-58002 Buried Layer Epitaxial Wafer is primarily used in the manufacturing of power management ICs (PMIC), where it enhances device performance by reducing series resistance and simplifying isolation technology. It is also applicable in various specialized semiconductor platforms.
Market Potential in Latin America, Arab Countries, and Africa:
These regions are experiencing rapid growth in the electronics and semiconductor industries, driven by increasing demand for consumer electronics, automotive components, and industrial applications. The GJ-58002 product offers significant opportunities in these markets due to its advanced technology and ability to improve semiconductor device performance.
Resources and Conditions for Distribution:
- Technical Knowledge: Distributors should have a solid understanding of semiconductor technology and epitaxial processes.
- Local Networks: Strong connections with local semiconductor manufacturers and electronics companies will be crucial.
- Logistics Capabilities: Efficient logistics for handling and delivering sensitive semiconductor materials are essential.
Customer Targets:
Focus on semiconductor manufacturers, especially those involved in power management IC production, as well as companies in the automotive, telecommunications, and industrial electronics sectors. Establish partnerships with key players in the local supply chain to effectively penetrate these markets.
