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KD-52001 Metallized conductive silver paste series

KD-52001 Metallized conductive silver paste series

Photovoltaic Cells

As the smallest power generation unit behind photovoltaic electricity, the efficiency improvements of photovoltaic cells are highly dependent on the contribution of conductive silver paste.

  • KD-52001-A p-POLO IBC Cell

    A - High-temperature sintering conductive silver paste:
    Custom-developed glass system that meets the stringent requirements of ohmic contact and metal complex in complex processing systems. It ensures excellent adhesion and is applied in back-surface step printing.

     

    B - High-temperature sintering conductive silver paste:
    Non-burning glass design, providing superior weldability with low solid content. It is suitable for MBB/SMBB welding processes and applied in back-surface main grid printing.

  • KD-52001-B p-BSF Cell

    A - High-temperature sintering conductive silver paste:
    Provides excellent fine line printing and weldability, applied in single or step printing of the front grid.

     

    B - High-temperature sintering conductive silver paste:
    Non-burning glass design, providing superior weldability under low solid content. It is suitable for MBB/SMBB welding processes and applied in front grid printing.

  • KD-52001-C p-PERC Cell

    A - High-temperature sintering conductive silver paste:
    Ensures superior ohmic contact and metal complex control, suitable for ≥220Ohm/sq phosphorus doping process, and provides excellent ultra-fine line printing capability (≤13um). Used in single or step printing of the front grid.

     

    B - High-temperature sintering conductive silver paste:
    Non-burning glass design with low solid content, offering superior weldability. Suitable for MBB/SMBB welding processes, applied in front grid step printing.

  • KD-52001-D n-TOPCon Cell

    A - High-temperature sintering conductive silver-aluminum paste:
    Features an innovative inorganic system with balanced ohmic contact and metal complex design, suitable for ≥160Ohm/sq boron doping processes or selective emitter processes. Provides excellent ultra-fine line printing capability (≤15um), used in front grid step printing.

     

    B - High-temperature sintering conductive silver paste:
    This glass system supports polishing processes and ≤120nm phosphorus-doped polysilicon layers with stringent ohmic contact and metal complex requirements. It also offers excellent adhesion for back grid step printing.

     

    C - High-temperature sintering conductive silver paste:
    Non-burning glass design with superior weldability under low solid content, applied in both front and back grid step printing for MBB/SMBB welding.

  • KD-52001-E n-HJT Cell

    A - Low-temperature curing conductive silver paste:
    Excellent bulk resistivity and fine line printing (<18um). Suitable for 5-20min fast curing and ≥350mm/s high-speed printing processes, used in front and back grid step printing.

     

    B - Low-temperature curing silver-coated copper conductive silver paste:
    Offers complete silver coating, sufficient silver thickness, and appropriate copper content, providing cost-effective metallization solutions with 30-50% copper content for clients.

     

    C - Low-temperature curing conductive silver paste:
    Provides superior weldability and thermal aging stability, suitable for MBB/SMBB welding processes, applied in front and back grid step printing.

  • KD-52001-F AMB Ceramic Copper-Clad Plates

    Semiconductor Ceramic Copper-Clad Plates

    As the key to the development of third-generation power semiconductors, the high thermal conductivity and reliability of AMB ceramic copper-clad plates are closely tied to the active metal brazing paste.

     

    A - BSN Brazing Paste:
    Low void ratio, high reliability, with excellent copper layer bonding strength, offering strong adhesion to Si3N4 substrates.

     

    B - BAN Brazing Paste:
    High thermal conductivity, low void ratio, with good stress matching and strong bonding to AlN substrates.

     

    C - BSC Brazing Paste:
    High thermal conductivity and copper bonding strength, with good stress matching, suitable for bonding to SiC substrates.

  • Application Scenarios:

    For the KD-52001 series of conductive silver pastes in the Latin American, Arab, and African markets, the potential is substantial due to the growing demand for photovoltaic energy solutions and advanced semiconductor technologies in these regions.

    Photovoltaic cells, heavily reliant on conductive silver pastes, are key in renewable energy initiatives. The semiconductor market, driven by technological advancements, also presents opportunities for these pastes, particularly in high-efficiency solar panels and next-gen electronics.

    Market Potential and Opportunities:

    • Latin America: The region is experiencing rapid growth in solar energy, especially in countries like Brazil, Mexico, and Chile. The increasing adoption of photovoltaic systems in residential, commercial, and industrial sectors aligns well with the KD-52001 series, especially for improving energy conversion efficiency in solar panels.
    • Arab Countries: The Middle East is aggressively investing in solar power to diversify its energy portfolio. Nations like Saudi Arabia and the UAE are pioneers in large-scale solar projects, offering a promising market for conductive silver pastes. The demand for high-efficiency solar cells in harsh climates presents a perfect fit for high-temperature sintering conductive pastes.
    • Africa: With a growing focus on renewable energy, particularly in regions with high solar irradiation like North Africa and Sub-Saharan Africa, this product series is well-positioned to enhance the efficiency of photovoltaic cells used in off-grid and mini-grid solutions.

     

    Recommended Resources or Conditions for Distributors:

    • Technical Expertise: Distributors should have a solid understanding of the local photovoltaic and electronics markets, including solar panel manufacturing and assembly.
    • Distribution Channels: Access to solar energy project developers, EPC (Engineering, Procurement, and Construction) firms, and electronics manufacturers.
    • Partnerships: Collaborations with local government renewable energy programs or private-sector initiatives to promote the adoption of high-efficiency solar technology.

     

    Customer Targets:

    • Solar Energy Companies: Firms involved in the installation and maintenance of solar energy systems.
    • Electronics Manufacturers: Companies producing semiconductors or power electronics requiring efficient conductive materials for high-performance applications.
    • Public and Private Sector Projects: Organizations driving renewable energy initiatives, including solar farms and public infrastructure projects, as potential end-users.

     

    By entering these markets, the KD-52001 series offers local businesses a chance to leverage the growing renewable energy sector and capitalize on increasing solar adoption trends, providing a product that boosts energy conversion efficiency and long-term stability in challenging environments.

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