KD-52002 Interconnected Conductive Silver Paste Series
In the development of modern power electronics, high-density, high-flexibility, and high-reliability packaging is essential. We focus on semiconductor and power electronics interconnect materials, aiming to empower the world through our multi-functional conductive silver paste products.
KD-52002-A:
Third Generation Semiconductor Chip - Low-Temperature Sintered Silver Paste
- Polymer-Assisted Full Sintering Paste: Enables low-temperature sintering at 220°C with high thermal conductivity, suitable for SiC, GaN power semiconductor packaging.
- 15K Pure Silver Full Sintering Paste: Exceptional thermal and electrical conductivity, tested reliability, for high-power semiconductor packaging.
KD-52002-B: Semiconductor Packaging Paste
A-Conventional Thermal Conductive Low Temperature Conductive Silver Paste
- Excellent filler and functional resin combination, with good bonding performance and reliability, suitable for high-speed dispensing equipment, suitable for bonding IC and LED small chips
B-Conventional Thermal Conductive Low Temperature Conductive Silver Paste
- Excellent filler and functional resin combination, with good adhesion performance and reliability, reaching the international equivalent MSL level, suitable for packaging analog circuit semiconductor devices such as power management chips, filters, and antennas, as well as general-purpose processors such as CPUs and GPUs, and conventional consumer chips such as FPGAs
C-high thermal conductivity type low-temperature conductive silver paste
- Innovative high-density silver technology with high adhesion and excellent thermal conductivity, suitable for small and medium-sized power chip packaging, such as MCU control chips and primary power amplifiers for power device chip packaging
KD-52002-C Photovoltaic Stacked Tile Module
Advanced photovoltaic modules
Electronic adhesives are expected to replace traditional welding processes and become the key to new high-density, flexible component interconnect technologies.
A-Low temperature conductive silver paste- Excellent electrical performance and weather resistance, extremely strong shear strength, balanced flexibility design, used for inter sheet interconnection of stacked tile batteries, 0BB interconnection of HJT batteries, etc
B-Low temperature non-conductive silver paste- Excellent weather resistance and flexibility, extremely strong shear strength, used for inter sheet interconnection of stacked tile batteries, 0BB interconnection of HJT batteries, etc
Application Scenarios:
The KD-52002 Conductive Silver Paste Series has extensive applications in the power electronics and semiconductor packaging industries, particularly for advanced photovoltaic components.
Its key features make it highly suitable for regions with emerging renewable energy and electronic sectors, such as Latin America, the Middle East, and Africa.
Market Opportunities & Potential:
- Renewable energy: Rapid growth in solar energy in these regions increases demand for high-performance photovoltaic components.
- Electronics: Growing semiconductor and electronics industries.
- Industrial: Rising demand for energy-efficient and reliable semiconductor packaging.
Target Customers:
Solar panel manufacturers.
Semiconductor manufacturers.
Electronic component suppliers.
Resources & Conditions for Distributors:
- Basic knowledge of photovoltaic and semiconductor markets.
- Technical support for customers: Understanding of conductive silver paste applications.
- Strong supply chain connections: Access to renewable energy and electronic equipment markets.
